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 OKI Semiconductor MR27V12850J
8M-Word x 16-Bit or 16M-Word x 8-Bit Page mode
FEDR27V12850J-02-03
Issue Date: Jul. 9, 2004
P2ROM
FEATURES
*8,388,608-word x 16-bit/16,777,216-word x 8-bit electrically switchable configuration * Page size of 8-word x 16-Bit or 16-word x 8-Bit * 3.0 V to 3.6 V power supply * Access time 100 ns MAX * Page Access time 25 ns MAX * Operating current 50 mA MAX(5MHz) * Standby current 10 A MAX * Input/Output TTL compatible * Three-state output
PIN CONFIGURATION (TOP VIEW)
BYTE# A16 A15 A14 A13 A12 A11 A10 A9 A8 A19 A21 A20 A18 A17 A7 A6 A5 A4 A3 A2 A1 A0 CE#
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25
PACKAGES
* MR27V12850J-XXXTN 48-pin plastic TSOP (TSOP I 48-P-1220-0.50-1K)
P2ROM ADVANCED TECHNOLOGY
P2ROM stands for Production Programmed ROM. This exclusive Oki technology utilizes factory test equipment for programming the customers code into the P2ROM prior to final production testing. Advancements in this technology allows production costs to be equivalent to MASKROM and has many advantages and added benefits over the other non-volatile technologies, which include the following; * Short lead time, since the P2ROM is programmed at the final stage of the production process, a large P2ROM inventory "bank system" of un-programmed packaged products are maintained to provide an aggressive lead-time and minimize liability as a custom product. * No mask charge, since P2ROMs do not utilize a custom mask for storing customer code, no mask charges apply. * No additional programming charge, unlike Flash and OTP that require additional programming and handling costs, the P2ROM already has the code loaded at the factory with minimal effect on the production throughput. The cost is included in the unit price. * Custom Marking is available at no additional charge. * Pin Compatible with Mask ROM
Vss Vss D15/A-1 D7 D14 D6 D13 D5 D12 D4 VCC VCC A22 D11 D3 D10 D2 D9 D1 D8 D0 OE # Vss Vss
48TSOP(Type-I)
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FEDR27V12850J-02-03
OKI Semiconductor
MR27V12850J / P2ROM
BLOCK DIAGRAM
A-1 x 8/x 16 Switch CE# CE OE# OE BYTE#
A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 A19 A20 A21 A22
Row Decoder
Memory Cell Matrix 8M x 16-Bit or 16M x 8-Bit
Address Buffer
Column Decoder
Multiplexer
Output Buffer
D0 D1
D2 D3
D4 D5
D6 D7
D8 D9
D10
D12
D14 D15
D11
D13
In 8-bit output mode, these pins are placed in a high-Z state and pin D15 functions as the A-1 address pin.
PIN DESCRIPTIONS
Pin name D15 / A-1 A0 to A22 D0 to D14 CE# OE# BYTE# VCC VSS Address inputs Data outputs Chip enable input Output enable input Word / Byte select input Power supply voltage Ground Functions Data output / Address input
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OKI Semiconductor
MR27V12850J / P2ROM
FUNCTION TABLE
Mode Read (16-Bit) Read (8-Bit) Output disable Standby : Don't Care (H or L) CE# L L L H OE# L L H BYTE# H L H L H L 3.0 V to 3.6 V Hi-Z DOUT VCC D0 to D7 D8 to D14 DOUT Hi-Z Hi-Z L/H D15/A-1
ABSOLUTE MAXIMUM RATINGS
Parameter Operating temperature under bias Storage temperature Input voltage Output voltage Power supply voltage Power dissipation per package Output short circuit current Symbol Ta Tstg VI VO VCC PD IOS Ta = 25C -- relative to VSS Condition -- Value 0 to 70 -55 to 125 -0.5 to VCC+0.5 -0.5 to VCC+0.5 -0.5 to 5 1.0 10 Unit C C V V V W mA
RECOMMENDED OPERATING CONDITIONS
(Ta = 0 to 70C) Parameter VCC power supply voltage Input "H" level Input "L" level Symbol VCC VIH VIL VCC = 3.0 to 3.6 V Condition Min. 3.0 2.2 -0.5 Typ. -- -- -- Max. 3.6 VCC+0.5 0.6 Unit V V V
Voltage is relative to VSS. : Vcc+1.5V(Max.) when pulse width of overshoot is less than 10ns. : -1.5V(Min.) when pulse width of undershoot is less than 10ns.
PIN CAPACITANCE
(VCC = 3.0 V, Ta = 25C, f = 1 MHz) Parameter Input BYTE# Output Symbol CIN1 CIN2 COUT Condition VI = 0 V VO = 0 V Min. -- -- -- Typ. -- -- -- Max. 8 200 10 pF Unit
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OKI Semiconductor
MR27V12850J / P2ROM
ELECTRICAL CHARACTERISTICS
DC Characteristics
(VCC = 3.0 to 3.6 V, Ta = 0 to 70C) Parameter Input leakage current Output leakage current VCC power supply current (Standby) VCC power supply current (Read) Input "H" level Input "L" level Output "H" level Output "L" level Symbol ILI ILO ICCSC ICCST ICCA VIH VIL VOH VOL Condition VI = 0 to VCC VO = 0 to VCC CE# = VCC CE# = VIH CE# = VIL, OE# = VIH f=5MHz -- -- IOH = -1 mA IOL = 2 mA Min. -- -- -- -- -- 2.2 -0.5 2.4 -- Typ. -- -- -- -- -- -- -- -- -- Max. 5 5 10 1 50 VCC+0.5 0.6 -- 0.4 Unit A A A mA mA V V V V
Voltage is relative to VSS. : Vcc+1.5V(Max.) when pulse width of overshoot is less than 10ns. : -1.5V(Min.) when pulse width of undershoot is less than 10ns.
AC Characteristics
(VCC = 3.0 to 3.6 V, Ta = 0 to 70C) Parameter Address cycle time Address access time Page cycle time Page access time CE# access time OE# access time Output disable time Output hold time Symbol tC tACC tPC tPAC tCE tOE tCHZ tOHZ tOH Condition -- CE# = OE# = VIL -- -- OE# = VIL CE# = VIL OE# = VIL CE# = VIL CE# = OE# = VIL Min. 100 -- 25 -- -- -- 0 0 0 Max. -- 100 -- 25 100 30 20 20 -- Unit ns ns ns ns ns ns ns ns ns
Measurement conditions Input signal level --------------------------------------0 V/3 V Input timing reference level-------------------------1/2Vcc Output load ---------------------------------------------50 pF Output timing reference level ------------------- 1/2Vcc Output load Output 50 pF (Including scope and jig)
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OKI Semiconductor
MR27V12850J / P2ROM
TIMING CHART (READ CYCLE)
RANDOM ACCESS MODE READ CYCLE
tC
A0 to A22 (Word mode) A-1 to A22 (Byte mode)
tC
tOH tCE
CE#
tACC tCHZ
tOE
OE#
tOH
tACC
D0 to D15(Word mode) D0 to D7(Byte mode) Hi-Z D8 to D15 : Hi-Z(Byte mode) Valid Data
tOHZ
Valid Data Hi-Z
PAGE ACCESS MODE READ CYCLE
tC A3 to A21 tPC A0 to A2 (Word mode) A-1 to A2 (Byte mode) tCE CE# tOE OE# tACC D0 to D15(Word mode) D0 to D7(Byte mode) D8 to D15 : Hi-Z(Byte mode) tPAC tPAC tOHZ tCHZ tOH tPC
Hi-Z
Hi-Z
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FEDR27V12850J-02-03
OKI Semiconductor
MR27V12850J / P2ROM
(Unit: mm)
TSOP(1)48-P-1220-0.50-1K
Mirror finish
5
Notes for Mounting the Surface Mount Type Package
Package material Lead frame material Pin treatment Package weight (g) Rev. No./Last Revised
Epoxy resin 42 alloy Solder plating (5m) 0.55 TYP. 1/Dec. 2, 1999
The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki's responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times).
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OKI Semiconductor
MR27V12850J / P2ROM
REVISION HISTORY
Document No. FEDR27V12850J-02-01 FEDR27V12850J-02-02 FEDR27V12850J-02-03
Page Date Previous Edition - 1 3 Current Edition - 1 3 Final edition 1 Change 48TSOP(1) package code to -1K Add PD condition and IOS = 10mA Description
Dec., 2002 Jun. 4, 2003 Jul. 9, 2004
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FEDR27V12850J-02-03
OKI Semiconductor
MR27V12850J / P2ROM
NOTICE 1. The information contained herein can change without notice owing to product and/or technical improvements. Before using the product, please make sure that the information being referred to is up-to-date. 2. The outline of action and examples for application circuits described herein have been chosen as an explanation for the standard action and performance of the product. When planning to use the product, please ensure that the external conditions are reflected in the actual circuit, assembly, and program designs. When designing your product, please use our product below the specified maximum ratings and within the specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating temperature. Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified maximum ratings or operation outside the specified operating range. Neither indemnity against nor license of a third party's industrial and intellectual property right, etc. is granted by us in connection with the use of the product and/or the information and drawings contained herein. No responsibility is assumed by us for any infringement of a third party's right which may result from the use thereof. The products listed in this document are intended for use in general electronics equipment for commercial applications (e.g., office automation, communication equipment, measurement equipment, consumer electronics, etc.). These products are not, unless specifically authorized by Oki, authorized for use in any system or application that requires special or enhanced quality and reliability characteristics nor in any system or application where the failure of such system or application may result in the loss or damage of property, or death or injury to humans. Such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace equipment, nuclear power control, medical equipment, and life-support systems. Certain products in this document may need government approval before they can be exported to particular countries. The purchaser assumes the responsibility of determining the legality of export of these products and will take appropriate and necessary steps at their own expense for these. No part of the contents contained herein may be reprinted or reproduced without our prior permission. Copyright 2004 Oki Electric Industry Co., Ltd.
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